High Power Electronics Cleaning Requirements for Improved Efficiency and Reliability
Today, power modules are widely used in high power applications such as hybrid electric vehicles, solar inverters, medical equipment, and UPS (Uninterruptable Power Supplies) devices. For energy efficiency reasons, high power devices such as MOSFETs, IGBTs and DCBs are subjected to increased performance requirements with greater packaging density and involves various metal material mix.
Moreover, they oftentimes are subjected to elevated temperature and power cycling environments, extremely high current flow and extreme thermal transfer requirements. Accordingly, even the slightest contaminants remaining on the surface will impede the reliability required in these critical and highly sensitive applications.
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