Defluxing of Copper Pillar Bumped Flip-Chips

April 26th, 11:00 AM EST

Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density. Join ZESTRON Academy to review a recently presented study that involved using straight DI-water and novel low-concentration alkaline cleaning agent on copper pillar bumped flip-chips and the challenges of effectively cleaning flux residues from under these components.


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