Multiple Thermal Cycles
June 21st, 11:00 AM EST
Today, multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. This can include the presence of Surface Mount Technology (SMT) and Through Hole Technology (THT), stacked components and double-sided circuitry. With the potential for multiple reflows, it is more important than ever to have a cleaning process that is optimized for it. Please join ZESTRON Academy as we thoroughly examine the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process.