Overcoming Challenges for Class III Assemblies

Sept 20th, 11:00 AM EST

Functionality and long-term reliability is critical when designing high-reliability electronic assemblies. During this webinar, we will provide a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Join us as we walk thru an in-depth case study that will detail the necessary steps involved in reducing the risk of failures while improving long-term reliability.


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