Advanced Packaging and Power Electronics:
A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges
ZESTRON Academy proudly presents the Advanced Packaging and Power Electronics webinar series! This free educational opportunity provides valuable knowledge on the latest advancements and trends within the Advanced Packaging and Power Electronics sector. This series is an excellent way to stay up-to-date and enhance your understanding of semiconductor materials, processes, and equipment.
Enhancing Performance of Copper Pillar Interconnects through Defluxing
June 15, 2023, 2:00 PM EST
Copper pillar bumping is a popular method used to create interconnects on flip chips, wherein copper pillars are used instead of traditional solder bumps. During the bumping process, a layer of flux is coated on the surface of the copper pillars to promote the wetting and bonding of the pillars to the substrate.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be presenting this topic, focusing specifically on the effectiveness of pure DI-water and comparing its cleaning performance to novel low-concentration cleaning agent in removing these flux residues from 150µm bump pitch and 30µm Cu pillar height. Ravi will provide an in-depth analysis of the comparative assessment performed utilizing several analytical/functional test methodologies based on the latest IPC and JEDEC standards.
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Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs
July 20, 2023, 2:00 PM EST
Defluxing ultra-fine pitch die on chip-on-wafer (CoW) packages is a critical step in the manufacturing process of microelectronics. However, defluxing these ultra-fine pitch die interconnects presents a unique challenge due to their small size and close proximity to one another.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be presenting a continuation of the previous copper pillar study focusing on the defluxing process for ultra-fine pitch die on chip-on-wafer (CoW) packages. Specifically, the study will investigate the appropriate cleaning solution and process parameters, such as temperature, concentration, and cleaning time, required to effectively remove the flux residues without damaging the delicate interconnects on CoW packages with a 10µm bump pitch and 10µm gap height between a top die and bottom silicon wafer. The results of this study will provide valuable insights into the defluxing process, enabling the production of high-quality microelectronics with improved reliability and performance.
Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
August 17, 2023, 2:00 PM EST
Flux residues are a common challenge in cleaning power electronics components. These residues can cause corrosion, electrical shorts, and other reliability issues, affecting the performance and longevity of the components. It is important to follow best practices for cleaning power electronics components to address this challenge.
Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will be providing an overview of the evolution of power electronics as well as going over the details of selecting the appropriate cleaning method, ensuring compatibility with the components, and validating the cleaning effectiveness. Ravi will also go over the several test methods that can be effectively used to validate the cleanliness of power electronics components. Through a series of case studies, we will look at complex component packages and what it takes to clean them successfully.
Corrosion in Power Electronics – ZESTRON Europe; Reliability and Surfaces Team
September 21, 2023, 2:00 PM EST
Join ZESTRON Academy’s Stefan Strixner, ZESTRON Europe Principal Engineer & Technology Analyst, to discuss how failures induced by corrosion mechanisms, such as electrochemical migration (ECM), are a growing challenge for power electronics manufacturers. The team will detail how these failures occur in practice, the cause and roles that materials and humidity play, and the strategies to avoid and/or remedy ECM and the anodic migration phenomenon (AMP).
For more information on ZESTRON's capabilities in Power Electronics, visit our webpage: https://www.zestron.com/usa/en/applications/semiconductor