Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges
May 23, 2024, 2:00 PM EDT
Join Sr. Applications Engineer, Ravi Parthasarathy, as he examines the complexities of High Bandwidth Memory (HBM) wafers, focusing on critical cleaning intricacies essential for surface treatment. Primary emphasis will be placed on the significance of surface preparation for sustained reliability and performance and include discussion on key challenges such as the complexities of delicate structure, chemical compatibility, residue elimination, and precise process control. In conclusion, the presentation summarizes the cleaning challenges and recommended best practices essential for optimized surface treatment of HBM wafers.
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