Ensuring Reliability in Advanced Packaging: The Cleaning Challenge

October 9th -  2:00 PM EDT

As semiconductor packaging evolves with technologies like SiP, fcBGA, PoP, and 2.5D, achieving effective cleaning has become more complex. Larger die sizes, increased bump counts, and lower standoff heights create significant challenges in removing flux residues, especially under low-profile components. With standoff heights now below 50μm, reduced outgassing during reflow makes flux removal even more difficult, increasing the risk of electrochemical migration and electrical leakage. Components like QFNs and LGAs with large thermal pads further complicate the process.

In this webinar, we will review how proper cleaning strategies are critical to ensuring long-term reliability in these advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.

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