Cleaning Compatibility for Complex Semiconductor and Electronic Assemblies

June 8th -  2:00 PM ET

As electronics assembly evolves, so do the challenges around cleaning, especially when working with fine powder, low metal load solder pastes used in paste jetting and the higher metal load pastes common in stencil printing.

Fine powders and lower metal loads can produce increased flux residues and thinner bond lines post reflow, creating unique demands on cleaning chemistry and equipment. This webinar will walk through assembly and cleaning procedures, with results from ion chromatography (IC), surface insulation resistance (SIR) testing, and visual inspection beneath destructively removed devices.

Building on prior SMT research, this session expands the focus to screen printing for SMT and jetting for semiconductor applications, helping you identify the best cleaning chemistry and equipment for your process.