ZESTRON will be presenting "Higher Defluxing Temperature & Low Standoff Component Cleaning – a Connection?"  

"Clean electronic assemblies with greater efficiency by increasing wash temperatures as high as 180°F."

As board density has increased and standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, yet wash temperature (thermal energy) has generally been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive.