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ZESTRON will be presenting "Higher Defluxing Temperature & Low Standoff Component Cleaning – a Connection?"  

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"Clean electronic assemblies with greater efficiency by increasing wash temperatures as high as 180°F."

As board density has increased and standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, yet wash temperature (thermal energy) has generally been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive.

 

 

 

*RESERVE A MEETING TO RECEIVE A COPY OF THE PAPER

Meet with us at the APEX EXPO this January in San Diego, CA and enjoy a live demo at our booth.

Just stop by Booth #3323 or enter your email above to get in touch and receive a copy of The High Temperature Cleaning Paper.