Cleanliness Comparison Study Newer Competitive Cleaning Agent - Case Study
The 2010’s and early 2020’s have seen drastic and dynamic growth and development across the SMT manufacturing industry. Board density has increased and stand-off heights have reduced, challenging the Printed Circuit Board (PCB) assembly process. PCBs have increased in engineered complexity, enabling processing power and capacity previously only dreamed of.
These new capacities and capabilities are made possible by the evolution of PCB construction materials like fluxes and solder pastes. This has required parallel development in other manufacturing processes like
PCB cleaning and defluxing.
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