Defluxing Advanced Packages
July 25th, 1:30 PM EDT
To increase power module yield and reliability, many in the electronics industry are developing new power packaging products. There is particular interest in targeting common failure locations, die and substrate attach, interconnection, and encapsulation. The resulting increase in packaging density and introduction of new materials makes it more challenging than ever to meet performance requirements. Through a series of case studies, this ZESTRON Academy webinar provides a look at factors to consider when selecting cleaning agents and optimizing cleaning processes to ensure material compatibility and maximum reliability.