Electrochemical migration - how field failures occur and how to avoid them. Part 1
Typical failure patterns that point to electrochemical migration are temporary and permanent short circuits.
But how does electrochemical migration occur? How can the risks be assessed and, most importantly, how can it be avoided? In practice, coating processes are frequently assumed to be a complete solution. The subject of the cleanliness of components is also discussed. But in order to provide a specific answer for individual cases, it is important to understand the details of the underlying processes.
The first part of this article explains the conditions and generation mechanism of electrochemical migration, the difference compared to other dendritic failures, and also addresses its consequences. The second part of the article discusses the various methods of preventing and avoiding field failures
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