Electrochemical migration - how field failures occur and how to avoid them / part 1
Electrochemical migration (ECM) is an important topic in terms of the reliability and life span of electronic components, and is repeatedly discussed as the possible trigger for field failures.
Due to the ever increasing requirements in terms of greater packing densities/miniaturisation as well as external environmental influences, focus is being placed on field failures triggered by humidity or impurities, particularly in components that are exposed to changing environmental influences.
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