Finding Fault: Accelerated Testing Of Coated Lead-Free Circuit Boards

Cleaning electronic circuit boards after reflow remains a critical problem, especially before boards are subjected to conformal coating or embedded in a potting compound.

Cleaning electronic circuit boards after reflow remains a critical problem, especially before boards are subjected to conformal coating or embedded in a potting compound. But not all cleaning processes are equal; there is a variety of materials that are created during the soldering steps significantly impair the cross linkage needed for good adhesion. These unwanted byproducts can be safely removed by using the appropriate cleaning processes. Specific analyses for so-called cross linking “toxins” are therefore highly recommended in addition to standardized cleanliness testing procedures, such as ionic contamination measurements. 

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