Thank you for attending
Advanced Packaging and its Impact on mm/Wave Applications
Your active involvement in the recent iNEMI Workshop on Advanced Packaging and its Impact on mm/Wave Applications, hosted by ZESTRON, made a difference. Your presence and engagement were instrumental in making this event a success, and we sincerely value your valuable contributions.
Click Here to Access the Recorded Workshop!
Explore the in-depth presentations by clicking on the titles below for downloadable PowerPoints.
Keynote- The Future of Heterogeneous Integration: Challenges and Opportunities
Prof. Madhavan Swaminathan, Penn State University
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Defluxing of Copper Pillar Bumped Flip Chips
Ravi Parthasarathy, ZESTRON
Madhu Stemmermann, SunRay Scientific
Advanced Manufacturing Technology Roadmaps- Program Overview
Lisa Fronczek, NIST Office of Advanced Manufacturing
Prof. Raj Pulugurtha, Florida International University
mmWaves and Beyond: Materials and Testing Needs
Prof. David S. Citrin, Georgia Institute of Technology
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Dielectic Materials Characterization Roadmap
Mike Hill, Intel
Lucas Enright, NIST
Shelby Nelson, Mosaic
Urmi Ray, iNEMI
Prof. Madhavan Swaminathan, Penn State University