Multiple Thermal Cycles
October 29th, 1:30 PM EDT
Please join ZESTRON Academy as we thoroughly examine the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process. Today, multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. This can include the presence of Surface Mount Technology (SMT) and Through Hole Technology (THT), stacked components and double-sided circuitry. With the potential for multiple reflows, it is more important than ever to have a cleaning process that is optimized for it.