Multiple Thermal Cycle
October 24th, 1:30 PM EDT
Multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. If the PCB includes Surface Mount Technology (SMT) and Through Hole Technology (THT), the board will be processed through both a reflow oven and a wave solder system. With more complex PCB designs that may use stacked components or double-sided circuitry, multiple reflows will be required. This ZESTRON Academy webinar looks at the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process.