Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
As computing chips evolve to offer enhanced functionalities, packages like SiP, fcBGA, PoP, and 2.5D have become more intricate, incorporating larger die sizes, increased bump counts, and lower standoff heights. These advancements have posed challenges in achieving effective cleaning.
The interconnects in these packages commonly use solder. Post-soldering, flux residues create significant cleaning hurdles, particularly beneath low-profile components. With standoff heights decreasing to less than 50μm, outgassing during reflow diminishes, further complicating flux residue removal. Components such as QFNs and LGAs with large thermal pads add to these challenges, risking reliability issues including electrochemical migration and electrical leakage.
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