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The Perils Of Ionic Testing
In recent years, several factors have converged to create a perfect storm in the cleaning world, significantly affecting the long-term reliability of improperly cleaned assemblies.
First, exciting design innovations continue to support the increasing demand for miniaturization. The resulting complex geometries, densely packed assemblies and low-standoff spacing increase the difficulty of removing flux residue, thereby elevating the risk of partically cleaned residues under low-standoff components.
Next, this challenge is increasing at a time when processes have been rapidly converted from eutectic to lead-free pastes. The associated higher reflow temperatures of lead-free processes result in increased amounts of “burned in” residues that are polymerized and hardened more than their eutectic counterparts.
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