2021 Cleaning Webinar Series Archives

SMT, THT, and semiconductor learning opportunities

ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 11:00 AM EDT, with a 45 minute presentation and 15 minute Q&A. If there is a specific cleaning topic you are interested in, please visit our customized training page. 

 

Why Cleaning is Critical Before Conformal Coating  - March 23rd 

Join ZESTRON Academy for an informative discussion on the importance of cleaning PCBs in today’s production environments, focusing on cleaning before conformal coating. We will examine: the methods and benefits of fully cleaning PCBs, how coating over residues can result in product failures, cleanliness assessment methods used before conformal coating as well as the test methods used to assess their reliability afterward, and share expert process recommendations to ensure that your products perform as expected over the long-term.

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DI-Water vs. Chemistry - April 27th  

In today’s PCB manufacturing environment, increased densities, reduced component sizes, low standoff heights, and a large variety of component packages combine to limit the effectiveness of cleaning with DI-water. Join ZESTRON Academy for an in-depth look at the cleaning agent technologies and process alternatives to pure DI-water.  We will examine key performance indicators including, cleanliness, material compatibility, power requirements, DI-water usage, and environmental impacts of using DI-water vs. chemistry.

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Jet Printing and Cleaning Challenges   - May 25th 

Today’s production environments are overcoming printing challenges by incorporating jet printing as an additional add-on step to add extra solder paste volume when needed. Typically, jet printing pastes use Type 5 and 6 solder powder compared to type 3 and 4.  As cleaning remains critical to long-term reliability, jet solder pastes have proven more difficult to clean. Join ZESTRON Academy to explore the reasons behind the increased cleaning challenges with comparative cleaning trial data and customer case studies.

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Surface Cleanliness: How Clean is Clean?  - June 22nd 

Often impurities left on a board’s surface or underneath components may lead to field failures. Join the experts at ZESTRON Academy for an in-depth review of the standardized and non-standardized test methods available to properly assess the cleanliness of assemblies after the cleaning process. Attend  this special webinar and discover the answer to a question we are so often asked – “How clean is clean?”.

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Solder Mask and Low Stand-off Component Cleaning – A Connection?  - July 27th 

Please join ZESTRON Academy in exploring the impact of different solder mask options on under component cleanliness. The solder mask is necessary for the long-term reliability of PCBs, but can its presence also impact cleaning process effectiveness? Our cleaning experts will examine the latest findings and key takeaways from this recently prepared and presented study during this webinar.

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Advanced Cleaning for Advanced Packages  - August 24th 

With increasing packaging densities and the introduction of new materials, join the experts at ZESTRON Academy to discuss overcoming present-day cleaning challenges associated with Class III Assemblies. Through a series of case studies, we will examine the complex component packages that are increasingly being used in the industry, their associated failure mechanisms, and discuss the factors to consider when selecting cleaning agents and optimizing your cleaning processes.

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Improvements in Yield and Reliability for SMT Processes  - September 21st 

Attend ZESTRON Academy’s webinar for an in-depth review of the process-related issues to paste and adhesive contaminated stencils, stencil cleaning technologies as well as implications of cleaning nano-coated stencils. We will also explore the principles of the underside wipe process and review the topic of misprinted board cleaning.

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Designing for Reliability in Class III Assemblies  - October 26th 

When designing high-reliability electronic assemblies, functionality is critical and long-term reliability is essential.  Join our webinar for a detailed overview of the various failure mechanisms including the challenges associated with improper cleaning, board complexity, material mix, component, and the package types used. Thru an in-depth case study examination, we will discuss the steps involved in reducing the risk of failures while improving long-term reliability.

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